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Global SMT Podcast

Global SMT and Packaging

Global SMT & Packaging APP, BLOG, PODCAST, Websites, Newsletters, Magazines, Videos and Social Media platforms (Facebook, Twitter, Linkedin, YouTUBE) are a regular source of information about worldwide trends in the PCBA – Printed Circuit Board Assembly, EMS – Electronics Manufacturing Services, ASM – Advanced Semiconductor Materials, 3D Printing, SMT – Surface Mount Technology, OTS – Open Technology Solutions, SFS – Smart Factory Solutions, IPC – Institute for Printed Circuits. These sources also give you exclusive access to CEO interviews, webinars, white papers, new products, panel discussions and videos interviews from trades shows / conferences / tech open days / networking. If necessary, your subscription can be cancelled at any time!

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  • 64 episodes
  • Avg 8 min
  • English

Episodes 64

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  • Friday · 7 min

    TRI expands geographically and launch new advanced packaging inspection equipment

    Robert Yebra talks about the geographical expansion of TRI and the product expansion into semiconductor advanced packaging. The company has already developed a wafer inspection system and will standardize a panel inspection model soon.TRI also manufacturers wire bond inspection equipment and die bond inspection.

  • Friday · 8 min

    iNeTEST expands into PCB and Advanced Packaging test solutions

    Soni Saran Singh discusses the 20 year history of iNeTEST and how it has evolved to deliver AOI, SPI, ICT, X-ray, Flying Probe and a wide range of other test solutions across the PCB assembly industry.The company plans to expand its activities to cover test solutions for PCB and semiconductor Advanced Packaging.

  • Friday · 7 min

    SEHO expand their presence in India with NMTronics

    Markus Walter talk about the recently anounced partnership between SEHO and NMTronics. The partnership will focus on sales and be supported by SEHO's exisiting team in India.Walter also discussed the wider footprint for SEHO in Asia.

  • Friday · 10 min

    NMT Automation evolves as a world class manufacturer of production equipment

    Soni Saran Singh tells the story of the evolution of NMT Automation. Under the "Make in India" scheme they started with conveyors and board handling systems and plan to expand this to semiconductor testing equipment.Singh also spoke at length about the talent acquisition and mentoring programs.

  • Friday · 6 min

    SPEA offer a wide range of end of line testers for PCBA and Advanced Packaging

    Luca Graglia explains why SPEA flying probers lead the market with linear motors and encoders. This level of speed and accuracy are well-suited to increasing miniaturisation in PCBA and advanced packaging.The company also manufactures bed of nails testers. They work with customers to advise which test methodology is best for them.

  • Friday · 6 min

    Comet Yxlon shows a strong footprint in India.

    Till Stegel is the Asia Sales Manager for Comet Yxlon. In India, the main models for the PCBA industry are the Cougar and Cheetah x-ray systems. The future roadmap for Comet Yxlon is focused on the semiconductor advanced packaging industry and further refining the accuracy, speed and versatility of their systems.

  • September 24 · 7 min

    ASMPT debut the SIPLACE V

    ASMPT debuted the new SIPLACE V pick and place mounter. Originally shown for the first time at Productronica, Germany in November 2025, the platform is 30 percent faster than the TX platform, with a more compact footprint, producing 105K CPH at an accuracy down to 25 microns. This is the first machine in this series, which will eventually replace the TX and SX platforms. It uses the same feeders, protecting customers existing investment and facilitating and easy transition.

  • September 23 · 17 min

    India's PCBA Manufacturing Evolution Navigating the Shift from Domestic to Global

    As India transitions from a domestic-focused manufacturing base to an export-driven international model, Indian PCBA manufacturers face a pivotal moment. This panel explores the opportunities and obstacles shaping the industry's growth: scaling production to meet global standards, building supply chain resilience, competing with established players in key markets, attracting talent and investment, and positioning India as a reliable partner in the global electronics ecosystem. Panelists: Soni Saran Singh, NMTronics; Brijesh Kamani, Rapidise

  • September 23 · 22 min

    India's Manufacturing and Semiconductor Mission & Policy Landscape

    The panel will discuss progress on the ECMS, (Electronic Component and Manufacturing Scheme) and how it folds into the India Semiconductor Mission (ISM), state-level incentive schemes (Gujarat, Tamil Nadu, Karnataka, Uttar Pradesh), and what's still needed to close the gap with established hubs like Taiwan and Malaysia.Panelists: Sanjeev Kumar, Arvind Consultancy; Niju Vijayan, Avanteum

  • September 23 · 7 min

    Heller Industries expand through localised manufacturing and leading-edge technologies

    David Heller, President & CEO, Heller Industries describes the benefits of working with NM Automation and local partners to build reflow ovens in India. The plan is to become a centre for export to Europe and USA in time.Heller also talked about the challenges of AI boards, 5G and semiconductor advanced packaging applications.

  • September 23 · 12 min

    NMTronics introduce the new FUJI CLT-FG for entry-level to mid-volume manufacturers

    Soni Saran Singh describes the tremendous growth in the India EMS market, which is transitioning from domestic production to a full service global exporter.Among the many line represented by NMTronics, the FUJI range of pick and place systems is one they are most proud of. At the show they introduced the latest CLT-FG mounter, which is a compact machine for start-up to mid-tier production. This complements the AIMEX-R and the NXTR platforms for higher volume production.

  • September 14 · 17 min

    May Kong Pemtron 1

    As package geometries shrink and functionality demands grow, the advanced packaging industry faces mounting challenges in energy, thermal management and speed — driving the adoption of technologies like hybrid bonding, co-packaged optics and panel-level packaging. Keeping process control on track through all of this falls to inspection.In this episode, May Kong, Global Business Director at Pemtron, joins Trevor Galbraith to discuss how specialized inspection equipment is keeping pace with the industry's rapid evolution. Topics include:▶ Panel-level packaging — how panel inspection compares to wafers, and the size limitations involved▶ Inspecting hybrid bonded packages and the defects to look for▶ BGA bump inspection and the most common defect types▶ Where advanced packaging inspection is headed over the next five years▶ The role Agentic AI will play in the inspection process#3DAOI #HybridBonding #PLP #CopackagedOptics #Pemtron

  • September 14 · 23 min

    From SMT Operator to Consulting Entrepreneur

    Surasshan "Supra" Supremaniam, founder of Toronto-based SMT Elite, discusses his path from SMT operator to nearly two decades of process engineering at Johnson Controls, then launching his own consultancy. He covers his referral-driven business model, feeding design issues back to layout engineers, bridging the industry's shrinking skills gap, tackling tough troubleshooting cases (including an ENIG wetting defect traced to a PCB shop contaminant), evaluating inspection equipment on real data rather than sales pitches, and his ongoing involvement with SMTA's Ontario chapter and Young Professionals Ambassador program.

  • September 11 · 9 min

    EIPC planning conference at THECA 2027

    EIPC President Rico Schluter gives his views on how the Thailand market is progressing.Also reflecting on a speech from Thailand's Deputy Prime minister whom has set up the aim of an entire electronics manufacturing eco-system.

  • September 10 · 6 min

    MKS presents at THECA 2026

    Jimmy Kan of MKS delivered a presentation on AI server PCB and optical modules, hot topics in the next year according to Kan.

  • September 10 · 39 min

    Is MES and MRP dead? The Impact of AI on Manufacturing

    In this episode, Trevor Galbraith sits down with Andrew Scheuermann, CEO of Arch Systems, and Francisco Almada Lobo, President of Critical Manufacturing, to unpack how AI is reshaping the factory floor. They debate whether AI will replace MES and MRP systems or simply extend them, exploring knowledge graphs, agentic workflows, frontline copilots, and the growing convergence of machine data with enterprise AI. The conversation closes on a critical question: as AI capabilities accelerate, are manufacturers equipped to manage the new security risks and attack vectors this shift introduces?#MES #MRP #AI #agenticai #datacenters #code #llms

  • September 9 · 7 min

    THECA 2026. KCE electronics discuss the benefits of vertical integration

    Pitharn Ongkosit is President of TPCA and KCE, the largest PCB manufacturer in Thailand. As a vertically integrated company, the KCE Group own TLM, a laminate manufacturer, which enables them to have tighter control over their supply chain and avoid material shortages.

  • September 9 · 6 min

    THECA 2026. Semiconductor manufacturing growth in Thailand

    Panpol Prugsachantana, Carsem Semiconductors describes the semiconductor manufacturing infrastructure in Thailand. Foreign companies investing in Thailand can benefit from sizeable grants and assistance from the Thai government.The semiconductor business in Thailand is largely driven by AI and data centers.

Showing 1–20 of 64 episodes