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Semi Doped · June 19 · 1 hr 9 min

Advanced Packaging, TSMC CoWoS, Intel EMIB

New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB. Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS. Three CoWOS flavors: silicon, organic RDL, local bridges EMIB embeds tiny bridges into the substrate, no interposer EMIB-T and EMIB-M add through-silicon vias and power capacitors Google is booking 3M TPUs on EMIB via MediaTek by 2028 Package sizes keep climbing: 5.5x reticle today, 40x ahead This episode is brought to you by SambaNova. Try SambaNova's fast inference today at the SambaNova Dashboard! Connect with Vik and Austin via a daily free newsletter: https://www.semidoped.com Vik's Paid Substack: https://www.viksnewsletter.com Austin's Paid Substack: https://www.chipstrat.com Chapters: (0:00) "There Is No Chip Without the Packaging" (0:28) Intro and SpaceX IPO Day (5:15) What We're Covering: CoWOS, EMIB, Google (7:40) Simple Packaging: Wire Bonds to Flip Chip (17:07) What Makes Packaging "Advanced" (33:44) CoWOS: Three Flavors Explained (45:30) EMIB: Intel's Embedded Bridge Approach (52:47) EMIB-T and EMIB-M (57:31) CoWOS vs. EMIB Trade-offs (1:02:18) Google's 3M TPU EMIB Order

0:00-1:09:03
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New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB.

Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS.

  • Three CoWOS flavors: silicon, organic RDL, local bridges
  • EMIB embeds tiny bridges into the substrate, no interposer
  • EMIB-T and EMIB-M add through-silicon vias and power capacitors
  • Google is booking 3M TPUs on EMIB via MediaTek by 2028
  • Package sizes keep climbing: 5.5x reticle today, 40x ahead

This episode is brought to you by SambaNova. Try SambaNova's fast inference today at the SambaNova Dashboard!

Connect with Vik and Austin via a daily free newsletter:
https://www.semidoped.com

Vik's Paid Substack: https://www.viksnewsletter.com
Austin's Paid Substack: https://www.chipstrat.com

Chapters:
(0:00) "There Is No Chip Without the Packaging"
(0:28) Intro and SpaceX IPO Day
(5:15) What We're Covering: CoWOS, EMIB, Google
(7:40) Simple Packaging: Wire Bonds to Flip Chip
(17:07) What Makes Packaging "Advanced"
(33:44) CoWOS: Three Flavors Explained
(45:30) EMIB: Intel's Embedded Bridge Approach
(52:47) EMIB-T and EMIB-M
(57:31) CoWOS vs. EMIB Trade-offs
(1:02:18) Google's 3M TPU EMIB Order

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